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Compare Armor receiving cards by driver-dependent loading, controller conditions and the image functions required by the cabinet.
Select A5s Plus when the required processing functions, video conditions and controller support match the cabinet. Verify its loading table and precise HUB mounting drawing before integration.
General image adjustment and PWM low latencyLearn more in our Shipping Policy →
Get support with product selection, compatibility, configuration, installation and after-sales service.
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Qabul qilish kartasi — Armor Series
The Armor models share high-density board connections and parallel or serial RGB data support. They differ in loading conditions, image processing and configuration workflows. Check video bit depth, driver ICs, controller support and the exact mounting drawing before selecting a card.
Both provide color management, 18bit+ and pixel calibration. Their loading limits differ; A5s Plus also documents PWM low-latency operation with additional firmware conditions for continuous-DCLK ICs.
A8S-N supports HDR10/HLG and Image Booster. Image Booster and low-latency behavior have driver conditions, while COEX changes the applicable 10-bit loading limit.
A10s Pro uses NCP files for configuration and supports adaptive thermal compensation and full-grayscale calibration. Match the required calibration equipment, IC support and COEX loading conditions.
A5s Plus, A7s Plus and A8S-N use a 70 × 45 mm footprint; A10s Pro uses 80 × 45 mm. Use each model’s high-density connector definitions.
Choose the appropriate loading value for the source bit depth and driver IC. Include the controller-specific 10-bit exceptions for A8S-N and A10s Pro.
Check controller, software, firmware and calibration requirements for each chosen function. A shared series name does not establish identical image features.
Use the exact model connector pin-out, dimensions and installation drawing for the cabinet. Observe the stated component clearances and ESD precautions.
Find your fit
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Model selection
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| Data groups | Up to 32 parallel RGB groups or 64 serial groups, expandable to 128 serial groups. | Up to 32 parallel RGB groups or 64 serial groups, expandable to 128 serial groups. | Up to 32 parallel RGB groups or 64 serial groups, expandable to 128 serial groups. | Up to 32 parallel RGB groups or 64 serial groups, expandable to 128 serial groups. |
| Input voltage | 3.8–5.5 V DC. V | 3.8–5.5 V DC. V | 3.8–5.5 V DC. V | 3.8–5.5 V DC. V |
| Rated power | 3 W | 3 W | 3 W | 4 W |
| Weight | 16.2 g | 17.4 g | 18.7 g | 22.8 g |
| Specifications | ||||
| Product use | Compact general LED receiving card supporting color management, 18bit+, pixel calibration, line adjustment and 3D. | Compact general LED receiving card supporting color management, 18bit+, pixel calibration, multi-batch adjustment and 3D. | Compact high-end LED receiving card with Image Booster, HDR10/HLG, pixel calibration, low-latency and 3D support. | High-end LED receiving card with NCP configuration, adaptive thermal compensation, full-grayscale calibration, Image Booster 3.0 and HDR10/HLG support. |
| Compatibility | 3D requires a 3D-capable controller. One-frame receiving-card latency is supported for PWM driver ICs; continuous-DCLK PWM ICs require custom firmware. RGB gamma adjustment requires a supporting controller and NovaLCT. | 3D requires a 3D-capable controller. RGB gamma adjustment requires a supporting controller and NovaLCT. Intelligent-module functions require dedicated firmware. | 3D requires a 3D-capable controller. Image Booster effects depend on driver ICs. One-frame receiving-card latency uses PWM ICs; continuous-DCLK PWM ICs require custom firmware. Arbitrary-angle display rotation requires MCTRL R5 and SmartLCT. COEX changes 10-bit loading limits. | 3D requires a 3D-capable controller. Uses NCP files for cabinet configuration, firmware and image tuning. Full-grayscale calibration requires NovaStar high-precision calibration and a scientific-grade camera. Image Booster effects and Frame Rate Adaptive 3.0 depend on driver IC support. One-frame receiving-card latency requires ICs with built-in RAM. |
| Rated power | 3 W | 3 W | 3 W | 4 W |
| Input voltage | 3.8–5.5 V DC. V | 3.8–5.5 V DC. V | 3.8–5.5 V DC. V | 3.8–5.5 V DC. V |
| Dimensions | 70.0 × 45.0 × 8.3 mm; specification axis order is not labeled. Mounting section specifies a maximum total component thickness of 8.7 mm. mm | 70.0 × 45.0 × 8.3 mm; specification axis order is not labeled. Mounting section specifies a maximum total component thickness of 8.7 mm. mm | 70.0 × 45.0 × 8.1 mm; specification axis order is not labeled. Mounting section specifies a maximum total component thickness of 8.6 mm. mm | 80.0 × 45.0 × 8.2 mm; specification axis order is not labeled. Mounting section specifies a maximum total component thickness of 9.0 mm. mm |
| Weight | 16.2 g | 17.4 g | 18.7 g | 22.8 g |
| Operating temperature | −20 to +70 °C; 10–90% RH, non-condensing. °C | −20 to +70 °C; 10–90% RH, non-condensing. °C | −20 to +70 °C; 10–90% RH, non-condensing. °C | −20 to +70 °C; 10–90% RH, non-condensing. °C |
| Installation | Install onto a compatible HUB board using the model drawing and grounded mounting holes. Hold the card near the middle of its two long sides while pressing it into the HUB connectors; observe ESD precautions. Obtain the precision drawing for tooling or mounting-hole manufacture. | Install onto a compatible HUB board using the model drawing and grounded mounting holes. Hold the card near the middle of its two long sides while pressing it into the HUB connectors; observe ESD precautions. Obtain the precision drawing for tooling or mounting-hole manufacture. | Install onto a compatible HUB board using the model drawing and grounded mounting holes. Hold the card near the middle of its two long sides while pressing it into the HUB connectors; observe ESD precautions. Obtain the precision drawing for tooling or mounting-hole manufacture. | Install onto a compatible HUB board using the model drawing and grounded mounting holes. Hold the card near the middle of its two long sides while pressing it into the HUB connectors; observe ESD precautions. Obtain the precision drawing for tooling or mounting-hole manufacture. |
| Receiving capacity | PWM ICs: 512 × 384 at 60 Hz with 8-bit video; 256 × 384 with 10/12-bit. General ICs: 384 × 384 with 8-bit; 192 × 384 with 10/12-bit. All limits are at 60 Hz. (Per-card limits with the stated video bit depth and driver/controller conditions; 60 Hz is video frame rate, not a screen refresh guarantee.) | PWM driver ICs: 512 × 512 at 60 Hz. General driver ICs: 512 × 384 at 60 Hz. (Per-card limits with the stated video bit depth and driver/controller conditions; 60 Hz is video frame rate, not a screen refresh guarantee.) | At 60 Hz: PWM ICs 512 × 384 (8-bit), 512 × 256 (10/12-bit); general ICs 384 × 384 (8-bit), 384 × 256 (10/12-bit). With COEX and 10-bit video: PWM 512 × 384; general ICs 384 × 384. (Per-card limits with the stated video bit depth and driver/controller conditions; 60 Hz is video frame rate, not a screen refresh guarantee.) | PWM ICs at 60 Hz: 512 × 512 with 8-bit video; 512 × 384 with 12-bit. For 10-bit video, 512 × 512 requires COEX; other controllers support 512 × 384. (Per-card limits with the stated video bit depth and driver/controller conditions; 60 Hz is video frame rate, not a screen refresh guarantee.) |
| Data groups | Up to 32 parallel RGB groups or 64 serial groups, expandable to 128 serial groups. | Up to 32 parallel RGB groups or 64 serial groups, expandable to 128 serial groups. | Up to 32 parallel RGB groups or 64 serial groups, expandable to 128 serial groups. | Up to 32 parallel RGB groups or 64 serial groups, expandable to 128 serial groups. |
| Interface type | High-density board-to-board connectors for hub-board integration; use the exact model pin definitions. | High-density board-to-board connectors for hub-board integration; use the exact model pin definitions. | High-density board-to-board connectors for hub-board integration; use the exact model pin definitions. | High-density board-to-board connectors for hub-board integration; use the exact model pin definitions. |
Check the stated conditions for each model before comparing values.
Ko‘p beriladigan savollar
Loading depends on the driver IC, source bit depth and sometimes the controller. A8S-N and A10s Pro include special 10-bit COEX conditions. Compare the value for your actual configuration rather than the largest number in the series.
No. A5s Plus and A7s Plus list general color management and 18bit+ functions. A8S-N lists HDR and Image Booster, while A10s Pro adds its documented NCP and advanced calibration workflow. Check each function and its prerequisites.
No. A5s Plus and A8S-N specify PWM IC conditions, with custom firmware for continuous-DCLK PWM ICs. A10s Pro requires ICs with built-in RAM. These statements describe the receiving-card stage, not total system latency.
Use the exact model drawing and pin definitions. A5s Plus, A7s Plus and A8S-N are documented at 70 × 45 mm, while A10s Pro is 80 × 45 mm; the total component-thickness limit also varies by model.
The English buyer page currently publishes A5s Plus Specifications V1.4.1, A7s Plus Specifications V1.2.5 and A8S-N Specifications V1.5.0. It does not currently publish an English A10s Pro specification.
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